LEADERG AOI-3 for Die Bond - LEADERG Cloud-based Automated Optical Inspection (AOI) System

Are you looking for a high-speed, high-accuracy Automated Optical Inspection (AOI) System for post die bonding inspection?    

Are you already frustrated with human misjudgment, inspection inefficiency, low yield rate, and low customer satisfaction currently on your production lines?

Relief has arrived--look no further than LEADERG Cloud-based AOI System - LEADERG AOI-3! :)

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Mission of This Production Stage:

The die bonding process is where individual dies are attached to lead frames (L/F), the metal structure within the chip package, either with the use of epoxy glue or the eutectic bonding technique under certain temperature. 

LEADERG AOI-3 for Die Bond can perform highly efficient and effective visual inspection, screening exterior defects prior to wire bonding process, while offering accurate yield rate analyses. 

In the Past, You Only Have These Options:

1.  Screening with Human Visual Inspection (Aided by a Magnifying Glass):

-  Limited human reliability in die and wafer inspection, while causing severe eye strain in operators

-  Highly variable in quality of each shipment, subject to individual operators' own judgment

-  High underkill rate, adding to growing customer dissatisfaction

-  Labor intensive and inefficient, with steep administrative and managerial cost

2.  Screening with Other AOI Systems on the Market: 

-  Steep financial and time cost of imported machine purchases and maintainence

-  Limited after-sales service and support; lack of flexibility in adjusting to immediate production changes

-  Uncertain and unstable results, when trying to meet your company's requirement of inspection speed and accuracy

LEADERG Cloud-based AOI System - 

LEADERG AOI-3 for Die Bond 

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Our Competitive Advantages:

1.  A Customized, End-to-end Product Design to Suit Local Needs: 

  • Localized, Customized, and Immediate Service:  Our locally based teams of engineers can quickly cutomize, modify, and test our AOI systems to suit your production lines' special needs.  No waiting necessary!

  • End-to-end System Design:  We are specialized in cost-efficient software/hardware integrated design.  With locally sourced high-quality hardware parts and update-on-demand software design, we can meet our clients' every needs with most cost-efficient solutions.

2. Detail-Oriented, Affordable Local Price Range Hardware Design with Imported Grade High Quality:

  • Stainless Steel-Plated, State-of-the-Art Chassis:  Our attention to every hardware design detail helps to extend our product's service life and reduce maintenance cost.

  • "Six-at-Once" Simultaneous Multi-Angle Camera Shot:  Combining an agile robotic arm with six cameras covering six different angles, our unique "six-at-once" multi-angle filming allows our clients to inspect individual die from above, below, the front, the back, the left, and the right of it, reducing inspection and response time.

3. Two Exclusive Technologies to Exceed Our Clients' Expectations:

  • Exclusive Cloud Computing Technology:  Our highly effective algorithms and cloud computing design will yield immediate improvement in the underkill and overkill rate of your product inspection, exceeding industry standard by far!

  • Exclusive Big Data Analysis Technology:  Our AOI System is capable of real-time analysis of product yield rate, helping our clients to quickly discover the crux of the problem on their production lines!

Accurate, high-speed, high price-performance ratio!

Most cost-efficient AOI System, but with optimal results!

Choose LEADERG and let your products LEAD the market!

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(LEADERG Cloud-based AOI System, Cloud Computing Architecture)

Inspection Items:

Topside Chipping
Backside Chipping
Chip Crack
Die Tilt
Chip Lifted
Die Orientation
Die Rotation
Epoxy on Chip
Die Scratch
Chip Position
INK Chip
Without D/A
L/F Foreign Material
L/F Deformation
Epoxy on Lead
Epoxy Coverage around Chip
Epoxy on Finger
Finger Foreign Material Residue
Foreign Material on Chip
Gold Finger Discolor
Foreign Material on Ball Pad
Substrate Scratch
Epoxy Overflow (LOC)

Allow us to design optimal-quality, satisfaction-guaranteed AOI solutions for your production lines with best results in mind!

Contact Us and How to Buy

Welcome to contact us. Please refer to the following link:


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Thanks for our customers

Taiwan University, Tsing Hua University, Yang Ming Chiao Tung University, Cheng Kung University, Taipei Medical University, Taipei University of Nursing and Health Sciences, National Chung Hsing University, Chi Nan University, Ilan University, United University, Defence University, Military Academy, Naval Academy, Feng Chia University, Chang Gung University, I-Shou University, Shih Chien University, Taiwan University of Science and Technology, Taichung University of Science and Technology, Yunlin University of Science and Technology, Chin-Yi University of Science, Formosa University, Pintung University of Science and Technology, Kaohsiung University of Science and Technology, Chaoyang University of Technology, Ming Chi University of Technology, Southern Taiwan University of Science and Technology, China University of Technology, Gushan Senior High School, Taipei Veterans General Hospital, Chang Gung Medical Foundation, Tzu Chi Medical Foundation, E-Da Hospital, Industry Technology Research Institute, Institute for Information Industry, Chung-Shan Institute of Science and Technology, Armaments Bureau, Ministry of Justice Investigation Bureau, Institute of Nuclear Energy Research, Endemic Species Research Institute, Institute of Labor, Occupational Safety And Health, Metal Industries Research & Development Centre, Taiwan Instrument Research Institute, Automotive Research & Testing Center, Taiwan Water Corporation, Taiwan Semiconductor Manufacturing Co., Ltd., United Microelectronics Corp., Nanya Technology, Winbond Electronics Corp., Xintec Inc., Arima Lasers Corporation, AU Optronics Corporation, Innolux Corporation, HannStar Display Corporation, Formosa Plastics Group., Formosa Technologies Corporation, Nan Ya Plastics Corp., Formosa Chemicals & Fibre Corporation, Chinese Petroleum Corporation, Logitech, ELAN Microelectronics Corp., Lextar Electronics Corporation, Darfon Electronics Corp., WPG Holdings, Mirle Automation Corporation, Symtek Automation Asia Co., Ltd, ChipMOS Technologies Inc., Dynapack International Technology Corporation, Primax Electronics Ltd., Feng Hsin Steel, China Ecotek, Grade Upon Technology Corp., AAEON Technology Inc., Stark Technology, Inc., Horng Terng Automation Co., Ltd., Zhen Ding Technology Holding Ltd, Boardtek Electronics Corporation, MiTAC International Corporation, Allion Labs, Inc., Sound Land Corp., Hong Hu Tech, etc.